Welcome to Micropower Devices/Systems & Nanomagnetics Group
MICROPOWER DEVICES/SYSTEMS & NANOMAGNETICS
  • About
  • Research
    • Micro Power generation
    • Power conversion for Microsystems
    • Nanostructured magnetic materials
  • Facilities
    • Sample Preparation
    • Structural Characterization Lab
    • Magnetic Characterization Lab
    • Vibration Energy Harvesting Setup
    • Tyndall Central Facility
    • Clean Room Facility
  • PUBLICATIONS
    • MEMS Vibrational Energy Harvesting
    • Power Supply on Chip
    • Materials Science
  • Group Members
    • Prof. Saibal Roy
    • Kankana Paul
    • Arindam Samanta
    • Kartik Sood
    • Alumni
  • Awards
    • News
    • Recent awards
    • Prof Saibal Roy INSA Chair Prof.
    • Previous Awards
  • Contact
  • Vacancies
  • Group Images
​Sample Preparation
​Structural Characterization Lab
​Magnetic Characterization Lab
​Vibration Energy Harvesting Setup
Tyndall Central Facility
​Clean Room Facility
Electroplating
Picture
Electroplating involves passing an electric current through a solution called an electrolyte. This is done by dipping two terminals called electrodes into the electrolyte and connecting them into a circuit with a battery or other power supply. The electrodes and electrolyte are made from carefully chosen elements or compounds. When the electricity flows through the circuit they make, the electrolyte splits up and some of the metal atoms it contains are deposited in a thin layer on top of one of the electrodes—it becomes electroplated. All kinds of metals can be plated in this way, including gold, silver, tin, zinc, copper, cadmium, chromium, nickel, platinum, and lead.
Sputtering
Picture
Sputtering is a process whereby particles are ejected from a solid target material due to bombardment of the target by energetic particles. It only happens when the kinetic energy of the incoming particles is much higher than conventional thermal energies (≫ 1 eV).


The Nordiko 2550 sputtering system.
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